Material Removal Behavior in Ultrasonic Assisted Grinding of SiC Ceramics

Ultrasonic assisted creep feed grinding of Inconel

The paper details the effects of depth of cut and vibration amplitude when ultrasonic assisted (US) creep feed grinding Inconel 718 with an open structured alumina based wheel. The workpiece was actuated at a constant frequency (~20.5kHz) via a block sonotrode attached to a 1kW piezoelectric transducer-generator system. A full factorial experimental array comprising 12 tests was conducted invol...

Ultrasonic assisted creep feed grinding of Inconel 718

The paper details the effects of depth of cut and vibration amplitude when ultrasonic assisted (US) creep feed grinding Inconel 718 with an open structured alumina based wheel. The workpiece was actuated at a constant frequency (~20.5kHz) via a block sonotrode attached to a 1kW piezoelectric transducer-generator system. A full factorial experimental array comprising 12 tests was conducted invol...

Understanding of Ultrasonic Assisted Machining with Diamond Grinding Tool

In this work, machining test was carried out in various machining conditions using ultrasonic vibration capable CNC machine. For work material, alumina ceramic (Al2O3) was used while for tool material diamond electroplated grinding wheel was used. To evaluate ultrasonic vibration effect, grinding test was performed with and without ultrasonic vibration in same machining condition. In ultrasonic...

GRINDING OF ASPHERICAL SiC MIRRORS

This paper describes the methods using bonded cup wheels for grinding toroidal and cylindrical SiC mirrors with large curvature radii. Since the angle between the cutting direction of bonded abrasives and feed direction of the cup wheel is about 90 °, it is possible to obtain a surface with very low surface roughness independent of the direction of measurement. Toroidal mirrors, circular and el...

Ultrasonic Flaw Detection in Ceramics